Radiation Hardened Electronics Market Analysis by Future Growth, Latest Trends And Key players

The Radiation Hardened Electronics market report gives a detailed analysis concentrated on the critical market dynamics such as drivers, restraints, trends, and growth opportunities to assist businesses to prepare for any challenges they might encounter in the forecast period. It also offers a regional analysis of the global Radiation Hardened Electronics market to explore possible growth prospects available in different parts of the world. The competitive landscape is broadly evaluated alongside the company profiles of key players engaged in the global Radiation Hardened Electronics market.

Increasing use of radiation-hardened electronics in several high-altitude applications is driving market revenue growth. This type of electronics are made of components such as silicon, silicon carbide, and gallium nitride, which are resistant to gamma and neutron radiation and high-energy radiation. These factors drive its adoption in applications such as aircraft, nuclear power plants, and satellites in the form of power supply devices, microprocessors, and switching regulators.

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Top Companies Radiation Hardened Electronics Market and Profiled in the Report are:

BAE Systems, Honeywell International Inc., Renesas Electronics Corporation, STMicroelectronics, Infineon Technologies AG, Microchip Technology Inc., IBM, Data Device Corporation, Cobham Limited, and Micropac Industries, Inc.

Key Highlights of Report

• Commercial-Off-The-Shelf (COTS) segment is expected to register fast growth rate during the forecast period owing to its high bandwidth and improved performance. Increasing demand for high bandwidth in satellite applications is expected to drive its adoption.
• Radiation-Hardening-By-Design (RHBD) segment is expected to register a robust revenue growth rate over the forecast period owing to easy modification, reduced cost per chip, and large-scale production.
• Power management segment is expected to register steady growth rate during the forecast period. Rising demand for metal-oxide-semiconductor field-effect transistor (MOSFETs), which is also known as metal-oxide-silicon transistor (MOSTs) and diodes for several high-end applications in defense and space industries are driving growth of power management.
• Market in Asia Pacific is expected to register high growth rate during the forecast period owing to better economic conditions in countries such as Japan, India, and China coupled with technological advancement in the manufacturing process. In addition, an increasing number of commercial space projects are also driving market growth in this region.

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Objectives of the Report:

• Study of the global Radiation Hardened Electronics market size by key regions, types, and applications with reference to historical data (2017-2018) and forecast (2020-2027)
• Industrial structure analysis of the Radiation Hardened Electronics market by identification of various sub-segments
• Extensive analysis of key market players along with their SWOT analysis
• Competitive landscape benchmarking
• Analysis of Radiation Hardened Electronics market based on growth trends, futuristic outlook, and contribution to the total growth of the market
• Analysis of drivers, constraints, opportunities, challenges, and risks in the global Radiation Hardened Electronics market
• Comprehensive analysis of competitive developments such as expansions, agreements, new product launches, and other strategic alliances

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Emergen Research has segmented global radiation-hardened electronics market on the basis of product type, material type, manufacturing technique, component type, application, and region:

• Product Type Outlook (Revenue, USD Million; 2019–2030)
  • Custom Made
  • Commercial-Off-The-Shelf (COTS)

• Material Type Outlook (Revenue, USD Million; 2019–2030)
  • Silicon
  • Silicon Carbide
  • Gallium Nitride
  • Others

• Manufacturing Technique Outlook (Revenue, USD Million; 2019–2030)
  • Radiation-Hardening-By-Design (RHBD)
  • Radiation-Hardening-By-Process (RHBP)
  • Radiation-Hardening-By-Software (RHBS)

• Component Type Outlook (Revenue, USD Million; 2019–2030)
  • Memory
  • Logic
  • Power Management
  • Field-Programmable Gate Array
  • Application Specific Integrated Circuit
  • Analog & Digital Mix Signals
  • Controllers & Processors

On the basis of regional analysis, the market is segmented into the following regions: North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. The market is expected to be dominated by North American nations closely followed by European countries. Asia Pacific is expected to show a significant growth owing to recent advancements and rising investments in the R&D sector.

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